Silicone Gap-Filler / Putty / Plastic TGF-ZP-SI 11 W/mK
Silicone Gap-Filler / Putty / Plastic TGF-ZP-SI 11 W/mK

Silicone Gap-Filler / Putty / Plastic TGF-ZP-SI 11 W/mK

Through the formulation and filling of the silicone elastomer with ceramic powder, an extremely high thermal conductivity is achieved. Its extreme softness and plastic form adaptability allow for optimal thermal contact with almost no pressure. This minimizes the overall thermal interface resistance. Due to its natural adhesive properties, the material can be easily pre-applied. • Plastic as putty • Extremely soft and form-adaptive • Thermal conductivity: 11 W/mK • Almost pressureless effect • For gaps smaller than 0.3 mm • Extremely aging/chemical resistant • Residue-free removal after application • Vibration-damping • Easy pre-assembly through self-adhesion Show complete detailed description Show less
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