Acrylic Adhesive / Thermally Conductive TAD-M-AC-2CG 1.75 W/mK

The glass bead filling provides a layer with defined thermal properties and a specific dielectric insulation. Curing begins immediately upon contact of the two components without the use of heat or primers. It is characterized by high wettability and adhesive strength on most surfaces. The formulation allows for separate application on each interface surface or as sandwich layers on just one surface. At least 80% of the surfaces should be covered. No mixing dispensing systems are required. Additional heat is not necessary and can lead to unfavorable partial polymerization. The adhesive is resistant to water, acids, and alkalis, as well as most organic solvents. • Thermal conductivity: 1.75 W/mK • High dielectric breakdown strength due to glass beads • Very high permanent adhesive strength • Extremely aging/chemical resistant • No need for mixing dispensing systems • Fast initial adhesion Show complete detailed description Show less