DIE-Strapping
DIE-Strapping

DIE-Strapping

Increasingly, unpackaged DIEs are being processed directly, which is why we offer automatic packaging of bare dies, CSPs, etc., directly from the wafer into SMD tape. - Component sizes from 0.28 to 8mm - Flip Chip - Wafer mapping or ink sorting - Wafers from 4" to 12"
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