ThermoEP-170 - technical epoxy resin
ThermoEP-170 - technical epoxy resinThermoEP-170 - technical epoxy resin

ThermoEP-170 - technical epoxy resin

About this product

ThermoEP-170 is a flame-retardant composite material based on epoxy resin with high adhesion and reliability. It is primarily used in IC, transistor, diode, network transformer, and other semiconductor encapsulations. It offers the advantages of a compact packaging size, low weight, simple structure, convenient processing, good chemical resistance, and electrical insulation performance, as well as excellent mechanical properties. In particular, compared to conventional encapsulation materials, the higher thermal conductivity allows for the expression of potentials in various levels of high-performance electronics packaging. Country of origin: China

Keywords

Epoxy Resins
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