Plasma Surface Treatment | Nano - Low Pressure Plasma Surface Treatment System, Plasma Cleaning

Diener electronic's plasma systems have long established themselves in various industrial sectors. With the Nano low-pressure plasma system, you are opting for modern and sustainable cold vacuum plasma technology. The chamber volume of 18 to 24 liters in this plasma system provides ample space for laboratories and series production. Low-pressure plasma treatment is a proven technique for controlled fine cleaning, adhesion enhancement (activation and etching), and thin film coating on substrate surfaces. The plasma is generated by using high-frequency voltage in the vacuum chamber. The treatment gas introduced is then ionized. Application: - VOC-free cleaning of organic residues. - Activation before varnishing, bonding, encapsulating, ... - Etching of PTFE, photoresist, oxide layers, ... Dimensions (tabletop unit): 560 mm x 600 - 860 mm x 600 mm (LxHxD) Dimensions (floor unit): 600 mm x 1700 mm x 800 mm (LxHxD) Vacuum chamber (material): Stainless steel, Aluminum, Quartz glass, Borosilicate glass Vacuum chamber (dimensions): approx. L 240 mm x H 240 mm x D 400 - 420 mm, Ø 267 mm, D 400 - 420 mm Vacuum chamber (volume): approx. 18 - 24 liters Vacuum chamber (closure): lid, hinged door Gas supply: Needle valves / Mass flow controllers (MFCs) Pressure measurement: Pirani, Capacitive manometer (for corrosive gas version) Generators: 100 kHz; 80 kHz; 13.56 MHz; 2.45 GHz Electrodes: One or multiple levels Control systems: Semi-automatic, Rotary knob, Basic PC, Full PC Voltage supply: 230 V / 400 V / 50 - 60 Hz Vacuum pumps: Suction power: 16 m³/h